• News
    • There is a new capacitor to the battery fast charging and high power. 1 minute charge to drive a small laptop running nearly half an hour - in October 2004, but the first, held in Makuhari Messe IT Expo »CEATEC Japan", such a demonstration fast charge has become a topic of concern ...

    • Intel has increased its investment in chip industry does not respond to negative peer Since its debut in 1964, CEF is an authoritative electronics in China, which is the only fair fully supported by China Ministry of Information Industry and Ministry of Commerce and was classed "A" exhibition in 2003 Department of Commerce


    PCB Technical capacity
    LayersMass production: 2~20 layers / Pilot run: 30 layers
    Max. Thickness Mass production: 394mil (10mm) / Pilot run: 17.5mm
    MaterialFR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.
    Min. Width/Spacing Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
    Max. Copper Thickness UL certificated: 6.0 OZ / Pilot run: 12OZ
    Min. Hole Size Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
    Max. Panel Size 1150mm × 560mm
    Aspect Ratio 18:1
    Surface Finish HASL、Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
    Special Process Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.


    Technical capacity
    SMTPosition accuracy:20 um
    Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
    Max. component height::25mm
    Max. PCB size:680×500mm
    PCB thickness:0.3 to 6mm
    PCB weight:3KG
    Wave-Solder Max. PCB width:450mm
    Component height:Top 120mm/Bot 15mm
    Metal type :part, whole, inlay, sidestep
    Sweat-Solder Metal material:Copper , Aluminum
    Surface Finish:plating Au, plating sliver , plating Sn
    Air bladder rate:less than20%
    Press-fit Press range:0-50KN
    Max. PCB size:800X600mm
    Testing ICT,Probe flying,burn-in,function test,temperature cycling

    Production Facility


    Samsung SMD:
    4 lines

    Fuji SMD:
    1 lines

    2 lines

    2 lines

    Trouble shooting

    Engineers: 10

    BGA Tester: 2

    Functional test